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MECH 553 Design and Manufacture of Microdevices (3 unit茅s)

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Nota : Ceci est la version 2021鈥�2022 de l'annuaire 茅lectronique. Veuillez mettre 脿 jour l'ann茅e dans la barre d'adresse de votre navigateur pour une version plus r茅cente de cette page, ou .

Offered by: G茅nie m茅canique (G茅nie et l'architecture)

Vue d'ensemble

G茅nie m茅canique : Introduction to microelectromechanical systems (MEMS). Micromachining techniques (thin-film deposition; lithography; etching; bonding). Microscale mechanical behaviour (deformation and fracture; residual stresses; adhesion; experimental techniques). Materials- and process-selection. Process integration. Design of microdevice components to meet specified performance and reliability targets using realistic manufacturing processes.

Terms: This course is not scheduled for the 2021-2022 academic year.

Instructors: There are no professors associated with this course for the 2021-2022 academic year.

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